UDC 66.088

LAG EFFECTS IN THE PLASMA ETCHING OF SILICON

Zapevalin Alexander Ivanovich
Penza State University
Postgraduate of "Instrument making" department

Abstract
The article discusses the Lag-effect occurring in the plasma-chemical etching process high-Aspect trenches of varying widths. Are some ways to minimize the influence of this effect on the process. Discusses the role of pressure and cycle times of etching / deposition on the Lag-effect.

Keywords: Bosch-process, Bosch-процесс, Lag effect.


Article reference:
Lag effects in the plasma etching of silicon // Modern technics and technologies. 2014. № 6 [Electronic journal]. URL: https://technology.snauka.ru/en/2014/06/3972

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